| Customization: | Available |
|---|---|
| Application: | Industrial Applications |
| Function: | Corrosion Preventive, Thermal Insulation and Sound Insulation, Waterproof and Moisture-proof, Wear Resistant |
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| Description | Semiconductor Ceramic plate |
| Material | 99.8% Alumina ceramic or SiC |
| Features | No trace metal contamination, No particle, High resistance |
| Flatness | 0.3um |
| Min Diameter of Pin | 0.2mm |
| Usage on semiconductor |
During the semiconductor manufacturing process, it is necessary to transfer wafers from one process equipment to another. The vacuum chuck can adsorb wafers safely and stably, ensuring that the wafers will not fall, slide or be damaged during the transfer process.
In the key process steps such as lithography, etching and coating, the vacuum chuck can firmly fix the wafers on the workbench, guaranteeing the positional accuracy of the wafers during the processing, thus ensuring the accuracy of the lithography patterns, the uniformity of the etching and the quality of the coating and so on. |
| General | Properties | Unit | 99.7%Al2o3 | 99%Al2O3 | 96%Al2O3 | ZTA | ZrO2 | SiC | AlN |
| Mechanical | Volume Density |
G/cm 3 | ≥3.90 | ≥3.85 | ≥3.65 | ≥4.2 | ≥6.0 | ≥3.13 | ≥3.2 |
| Hardness | HRA | 1700 | 1700 | 1500 | 1500 | 1300 | 2500 | 1100 | |
| Porosity | % | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
| Compressive Strength |
Mpa | ≥2600 | ≥2500 | ≥2050 | ≥2900 | ≥2500 | ≥2200 | ||
| Bending Strength |
Mpa | ≥410 | ≥350 | ≥320 | ≥400 | ≥1200 | ≥400 | ||
| Elastic Modulus |
Gpa | 370 | 350 | 300 | 380 | 210 | 400 | 320 | |
| Thermal | Thermal Conductivity |
W/m.K | 30 | 29 | 24 | 27 | 3 | 120~150 | ≥170 |
| Coefficient of Thermal Expansion |
1*10- 6m/k |
8.0~8.2 | 6.2~8.0 | 5.0~8.0 | 7.7~8.3 | 8.0~9.5 | 4 | 4.6 | |
| Electrical | Insulation Breakdown |
KV/mm | 19 | 8 | 18 | 18 | 17 | ||
| Volume Resistivity |
Ohm.Cm | >1*1014 | >1*1014 | >1*1014 | >1*1013 | >1*1011 | 5*106 |
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